Special Machines Building for Solar Technology
Roznov p.R., Czech Republic - Mumbai, India
Photo Documentation for Project "100 Mega Watt", February 2007

AWSM - Products

Glass and quartz plates and rings. Plates 240 x 240 x 2.32 mm, rings diameter 35 mm, thickness 330 microns. Glass, germanium and ferrites plates after slicing on the AWSM wire saw machines.

Glass and quartz plates and rings. Plates 240 x 240 x 2.32 mm, rings diameter 35 mm, thickness 330 microns. Silicon wafers for PV applications. PSQ wafers 102.5 x 102.5 mm, thickness 330 microns, multi-crystalline wafers 125 x 100 mm, thickness 240 microns.

Single crystal as cut Si wafers / diameter from 2" to 14", thickness 140 to 810 microns. Different Si as cut wafers for PV application.

Quartz rings - as cut, thickness 330 microns. PV single crystal wafers, 156 x 156 mm, thickness 240 microns in technological cassettes.

PV single crystal wafers, 156 x 156 mm, thickness 240 microns in PE box. - - -

(c) 2007
Gemtree Software & RNDr. Karel Vojtechovsky --- Shubha & Ravi
Roznov pod Radhostem, The Czech Republic --- Bangalore, India

Intellectual, production, & financial bases - Silicon 2008, new technologies & machines AWSM, SQM for slicing of Si ingots and other hard materials