The blue part is part of table carrier. On the table are connected metallic plates with glass substrates and glued cutted ingots. This ingot is pushed through of wire web by feet rate 0 - 600 micron per minutes, this speed is regulated during the slicing process according in machine implemented models or according custom data. Slicing time is function of ingot dimension, ingots shape and type of material - Actually is from 6 to 200 hours (process is possible to interrupt and restart too).

Intellectual, production, & financial bases - Silicon 2008, new technologies & machines AWSM, SQM for slicing of Si ingots and other hard materials