The machine AWSM 3800.5

Special Machines Building for Solar Technology
Roznov p.R., Czech Republic - Mumbai, India
Photo Documentation for Project "100 Mega Watt", February 2007

AWSM - In Action

Quartz block 320 x 320 x 800 mm before slicing on the loading arm of manipulator AWSM 3800.2d machine. Quartz block 320 x 320 x 800 mm after slicing on the AWSM 3800.2d machine.

Technological spool with 300 km wire, wire diameter 175 micrometer. Quartz plate slicing with very high precise orientation. Orientation sensitivity +- 5".

Quartz block slicing 405 x 405 x 800 mm, machine AWSM 3800.2d. Multi-crystalline Silicon blocks gluing before slicing.

Table of AWSM machine with glued 8 pc's of multi-crystalline blocks 125 x 125 x 200 mm for parallel 2 ingots slicing. Table of AWSM machine with glued 6 pc's of multi-crystalline blocks 156 x 156 x 250 mm for parallel 2 ingots slicing.

BD - booth direction slicing technology, AWSM 4800.0 machine. Ingot with diameter 200 mm. BD - booth direction slicing technology, AWSM 4800.1 machine. Ingot with diameter 340 mm.

Wafers diameter 300 mm after slicing in the AWSM 3800.3S wire saw machine. Silicon wafers after slicing. Wafer diameter 4", 6", 8" and 12".

In the slicing process - AWSM 4800.1, wafers diameter 340 mm. Wafers - ingot diameter 300 mm after slicing on the loading unit of the AWSM 3800.3d machine.

Ingot diameter 300 mm before slicing. Ingots diameters 100 mm and 300 mm before slicing.

Ingot diameter 300 mm in the slicing process, BD - technology on the TWS 3000e machine. Block / wafers of Zirconium Oxide black after slicing.

Cubic Zirconium Oxide after slicing on the AWSM machine. Quartz block 440 x 440 x 300 mm / ready slice on the AWSM 4800.1 machine.

Quartz block 440 x 440 x 300 mm in the AWSM 4800.1 machine, before slicing. Quartz block 440 x 440 x 300 mm in the AWSM 4800.1 machine, in slicing process.

Quartz block 440 x 440 x 300 mm / wafers with thickness 2,32 mm in the AWSM 4800.1 machine, after slicing process. Quartz block 440 x 440 x 300 mm / wafers with thickness 2.32 mm in the AWSM 4800.1 machine, moved out from machine.

Quartz wafer 440 x 440 x 2.32 mm - demonstration. Quartz block 200 x 200 x 800 mm in the AWSM 3800.2b machine, after slicing process.

Slicing of ceramics blocks, diameter 156 mm, AWSM 3800.3e wire saw machine. Slicing of ceramics blocks, diameter 156 mm, AWSM 3800.3e wire saw machine.

Table of AWSM machine for parallel 2 ingots slicing with blocks of multi-crystalline Silicon blocks. - - -

(c) 2007
Gemtree Software & RNDr. Karel Vojtechovsky --- Shubha & Ravi
Roznov pod Radhostem, The Czech Republic --- Bangalore, India

Intellectual, production, & financial bases - Silicon 2008, new technologies & machines AWSM, SQM for slicing of Si ingots and other hard materials


Quartz block 320 x 320 x 800 mm before slicing on the loading arm of manipulator AWSM 3800.2d machine.	Quartz block 320 x 320 x 800 mm after slicing on the AWSM 3800.2d machine.


Technological spool with 300 km wire, wire diameter 175 micrometer.	Quartz plate slicing with very high precise orientation. Orientation sensitivity +- 5".


Quartz block slicing 405 x 405 x 800 mm, machine AWSM 3800.2d.	Multi-crystalline Silicon blocks gluing before slicing.


Table of AWSM machine with glued 8 pc's of multi-crystalline blocks 125 x 125 x 200 mm for parallel 2 ingots slicing.	Table of AWSM machine with glued 6 pc's of multi-crystalline blocks 156 x 156 x 250 mm for parallel 2 ingots slicing.


Wafers diameter 300 mm after slicing in the AWSM 3800.3S wire saw machine.	Silicon wafers after slicing. Wafer diameter 4", 6", 8" and 12".


In the slicing process - AWSM 4800.1, wafers diameter 340 mm.	Wafers - ingot diameter 300 mm after slicing on the loading unit of the AWSM 3800.3d machine.


Ingot diameter 300 mm before slicing.	Ingots diameters 100 mm and 300 mm before slicing.


Ingot diameter 300 mm in the slicing process, BD - technology on the TWS 3000e machine.	Block / wafers of Zirconium Oxide black after slicing.


Cubic Zirconium Oxide after slicing on the AWSM machine.	Quartz block 440 x 440 x 300 mm / ready slice on the AWSM 4800.1 machine.


Quartz wafer 440 x 440 x 2.32 mm - demonstration.	Quartz block 200 x 200 x 800 mm in the AWSM 3800.2b machine, after slicing process.


Table of AWSM machine for parallel 2 ingots slicing with blocks of multi-crystalline Silicon blocks.	- - -